Use as primary component for making interconnection between an integrated circuit (IC) or other semiconductor device and providing a greater number of connection during device fabrication and packaging. It has the ability of being used at smaller diameter start at 12um up to hundred micrometer depends on its application, possessed with high thermal and electric conductivity extending the performance enhancement to comply with the current trend in semiconductor manufacturing
Integrated Metal Solution
| IM-SN | Nomal, Hight Loop | LED |
| IM-SL (Low) | Low Loop | LED, L/F Pkg. |
| IM-SL (Long) | Long Loop | L/F Pkg. |
| IM-SHP, IM-SUL | Ultra low, Fine pitch | high Performance |
| IM-SHTS, IM-SHS | High Reliability | 2N, 3N |
| IM-SA | Cost Effective | Au-Ag alloy |
Classification by Purity
Au Wire (Gold Bonding Wire)
4N (99.99%) / 3N(99.9%) / 2N(99%) gold wire
4N (99.99%) / 3N(99.9%) / 2N(99%) gold wire
Classification by HAZ & Customer's requirement
HAZ(Heat Affected Zone) Normal / High / Long / Low / Ultra Low
Customer's requirement Fine pitch / Ultra Low / High Reliability / Cost Effective Alloy
Customer's requirement Fine pitch / Ultra Low / High Reliability / Cost Effective Alloy
| IM-SA5 | High Percent Ag | Low Resistivity |
| IM-SA8 | Low Percent Ag | High Performance |
| IM-SA7 | High Percent Ag | LED Pkg. |
Classification by Purity
AgHP (High Percent ��95% Ag) / AgLP (Low Percent <95% Ag)
Classification by HAZ & Customer's requirement
Customer's requirement Normal / High / Long / Low / Ultra Low
| IM-SC5 | 5N grade Bare Cu | Fine pitch, High pin |
| IM-SC4 | 4N grade Bare Cu | Low pin count |
| IM-SAPC | AuPd coated Cu wre | High Yield, Cost effective |
| IM-SCP | CuPd alloy wire | High Performance |
Classification by Purity
5N / 4N Bare Cu
Classification by HAZ & Customer's requirement
Customer's requirement High Yield, Cost Effective, Long lifetime